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US07686968B2 Composition for removing conductive materials and manufacturing method of array substrate using the same 有权
用于除去导电材料的组合物及使用其的阵列基板的制造方法

Composition for removing conductive materials and manufacturing method of array substrate using the same
摘要：
A composition for removing a conductive material and a manufacturing method of an array substrate using the composition, wherein the composition may include a nitric acid of about 3 to 15 wt %, a phosphoric acid of about 40 to 70 wt %, an acetic acid of about 5 to 35 wt %. The composition may further include a chlorine compound of about 0.05 to 5 wt %, a chlorine stabilizer of about 0.01 to 5 wt %, a pH stabilizer of about 0.01 to 5 wt %, and water of residual quantity.
摘要（中）：

用于除去导电材料的组合物和使用该组合物的阵列基板的制造方法，其中所述组合物可以包括约3至15重量％的硝酸，约40至70重量％的磷酸， 约5〜35重量％。 该组合物可以进一步包括约0.05-5重量％的氯化合物，约0.01至5重量％的氯稳定剂，约0.01至5重量％的pH稳定剂和残留量的水。

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