发明授权
- 专利标题： Plurality of devices attached by solder bumps
- 专利标题（中）： 由焊料凸块附着的多种器件
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申请号： US11735952申请日： 2007-04-16
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公开(公告)号： US07687904B2公开(公告)日： 2010-03-30
- 发明人: Walter De Raedt , Steven Brebels , Steven Sanders , Tom Torfs , Eric Beyne
- 申请人： Walter De Raedt , Steven Brebels , Steven Sanders , Tom Torfs , Eric Beyne
- 申请人地址： BE Leuven
- 专利权人： IMEC
- 当前专利权人： IMEC
- 当前专利权人地址： BE Leuven
- 代理机构： Knobbe Martens Olson & Bear LLP
- 优先权： GB0414739.3 20040701
- 主分类号： H01L23/34
- IPC分类号： H01L23/34 ; H01L21/48 ; B23K31/02
摘要：
A method of bonding two elements such as wafers used in microelectronics applications is disclosed. One inventive aspect relates to a method for bonding comprising producing on a first main surface of a first element a first solder ball, producing on a first main surface of a second element a second solder ball, providing contact between the first solder ball and the second solder ball, bonding the first element and the second element by applying a reflow act whereby the solder balls melt and form a joined solder ball structure. Prior to the bonding, the first solder ball is laterally embedded in a nonconductive material, such that the upper part of the first solder ball is not covered by the non-conductive material. Devices related to such methods are also disclosed.
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