Invention Grant
- Patent Title: Micro-spray cooling system
- Patent Title (中): 微喷雾冷却系统
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Application No.: US11733175Application Date: 2007-04-09
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Publication No.: US07690214B2Publication Date: 2010-04-06
- Inventor: Chun-Fu Lu , Jinn-Cherng Yang , Chun-Jung Chen , Kuo-Hsiang Chien , Shih-Kuo Wu
- Applicant: Chun-Fu Lu , Jinn-Cherng Yang , Chun-Jung Chen , Kuo-Hsiang Chien , Shih-Kuo Wu
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Quintero Law Office
- Priority: TW95139157A 20061024
- Main IPC: F25D23/12
- IPC: F25D23/12

Abstract:
A micro-spray cooling system for a plurality of heat sources includes an evaporator contacting the heat sources and comprising a plurality of actuators corresponding to the heat sources, a condenser connected to the evaporator, and at least one driving circuit connected to the actuators to drive some or all of the actuators sequentially according to a predetermined timing to cool the heat sources. The refrigerant in the evaporator is sprayed by the actuators to thermally contact the heat sources, evaporated by heat from the heat sources, condensed in the condenser and re-enters the evaporator.
Public/Granted literature
- US20080101024A1 MICRO-SPRAY COOLING SYSTEM Public/Granted day:2008-05-01
Information query
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