Invention Grant
- Patent Title: Embossing apparatus and method
- Patent Title (中): 压花装置及方法
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Application No.: US11748542Application Date: 2007-05-15
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Publication No.: US07690913B2Publication Date: 2010-04-06
- Inventor: Hyoung-Kyu Son
- Applicant: Hyoung-Kyu Son
- Applicant Address: KR Sungnam-shi, Kyunggi-do
- Assignee: Advanced Display Process Engineering Co., Ltd.
- Current Assignee: Advanced Display Process Engineering Co., Ltd.
- Current Assignee Address: KR Sungnam-shi, Kyunggi-do
- Agency: KED & Associates LLP
- Priority: KR10-2006-0045146 20060519
- Main IPC: A01J21/00
- IPC: A01J21/00

Abstract:
An apparatus is provided that forms embossed portions on a workpiece. The apparatus includes a melting chamber filled with melt, such as ceramic, nozzles provided at a lower portion of the melting chamber, and presses provided adjacent to each of the injection nozzles. The injection nozzles drop the melt on the workpiece and the presses press the dropped melt into a predetermined shape of the embossed portions in a state where the dropped melt is being solidified after being dropped on the workpiece.
Public/Granted literature
- US20070266867A1 EMBOSSING APPARATUS AND METHOD Public/Granted day:2007-11-22
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