发明授权
- 专利标题： Multilayered lead frame for a semiconductor light-emitting device
- 专利标题（中）： 用于半导体发光器件的多层引线框架
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申请号： US10542419申请日： 2004-01-13
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公开(公告)号： US07692277B2公开(公告)日： 2010-04-06
- 发明人: Hidekazu Tomohiro , Masayuki Fujii , Norio Satou , Tomoyuki Yamada , Tomio Kusano
- 申请人： Hidekazu Tomohiro , Masayuki Fujii , Norio Satou , Tomoyuki Yamada , Tomio Kusano
- 申请人地址： JP Osaka
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： McDermott Will & Emery LLP
- 优先权： JP2003-007988 20030116
- 国际申请： PCT/JP2004/000152 WO 20040113
- 国际公布： WO2004/064154 WO 20040729
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
A lead frame (100) for a semiconductor device is formed by applying nickel plating (102), palladium plating (103), and gold flash plating (104) substantially entirely to lead frame body (101) such as copper thin plate in this order, and further applying silver plating (105) selectively to part of an inner part that is to be enclosed with a package of the semiconductor device. The lead frame (100) may also include a base of the package. The silver plating contributes to an excellent light reflectance and wire bonding efficiency of the inner part, whereas the gold flash plating contributes to an excellent resistance to corrosion and soldering efficiency of an outer part that is outside the package.
公开/授权文献
- US20060102936A1 Lead frame for a semiconductor device 公开/授权日：2006-05-18