Invention Grant
- Patent Title: Semiconductor electromechanical contact
- Patent Title (中): 半导体机电接触
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Application No.: US12204741Application Date: 2008-09-04
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Publication No.: US07695286B2Publication Date: 2010-04-13
- Inventor: Mark Swart , John Ellis
- Applicant: Mark Swart , John Ellis
- Applicant Address: US DE Wilmington
- Assignee: Delaware Capital Formation, Inc.
- Current Assignee: Delaware Capital Formation, Inc.
- Current Assignee Address: US DE Wilmington
- Agency: Christie, Parker & Hale, LLP.
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
A compliant electrical contact assembly for interconnecting a lead or terminal of an integrated circuit having two cantilever beams positioned within a slot in a housing arranged such that a portion of the beams slide along a portion of one another and within the housing as the beams are deformed elastically in order to allow more travel and compliance without yielding or totally deforming the beam. The sliding action during deformation effectively multiplies the total compliance in the assembly above and beyond the compliance otherwise available to elastic compression of the cantilever beams.
Public/Granted literature
- US20090075497A1 SEMICONDUCTOR ELECTROMECHANICAL CONTACT Public/Granted day:2009-03-19
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