Semiconductor electromechanical contact
    1.
    发明授权
    Semiconductor electromechanical contact 有权
    半导体机电接触

    公开(公告)号:US07695286B2

    公开(公告)日:2010-04-13

    申请号:US12204741

    申请日:2008-09-04

    Abstract: A compliant electrical contact assembly for interconnecting a lead or terminal of an integrated circuit having two cantilever beams positioned within a slot in a housing arranged such that a portion of the beams slide along a portion of one another and within the housing as the beams are deformed elastically in order to allow more travel and compliance without yielding or totally deforming the beam. The sliding action during deformation effectively multiplies the total compliance in the assembly above and beyond the compliance otherwise available to elastic compression of the cantilever beams.

    Abstract translation: 用于互连集成电路的引线或端子的顺应性电接触组件,该集成电路的引线或端子具有位于壳体内的槽内的两个悬臂梁,其布置成使得当梁变形时,梁的一部分沿着彼此的一部分滑动并且在壳体内滑动 弹性地为了允许更多的行进和顺应性而不产生屈曲或使梁完全变形。 变形期间的滑动动作有效地将上述组件中的总顺从性超越了悬臂梁的弹性压缩可用的顺从性。

    SEMICONDUCTOR ELECTROMECHANICAL CONTACT
    2.
    发明申请
    SEMICONDUCTOR ELECTROMECHANICAL CONTACT 有权
    半导体机电接触

    公开(公告)号:US20090075497A1

    公开(公告)日:2009-03-19

    申请号:US12204741

    申请日:2008-09-04

    Abstract: A compliant electrical contact assembly for interconnecting a lead or terminal of an integrated circuit having two cantilever beams positioned within a slot in a housing arranged such that a portion of the beams slide along a portion of one another and within the housing as the beams are deformed elastically in order to allow more travel and compliance without yielding or totally deforming the beam. The sliding action during deformation effectively multiplies the total compliance in the assembly above and beyond the compliance otherwise available to elastic compression of the cantilever beams.

    Abstract translation: 用于互连集成电路的引线或端子的顺应性电接触组件,该集成电路的引线或端子具有位于壳体内的槽内的两个悬臂梁,其布置成使得当梁变形时,梁的一部分沿着彼此的一部分滑动并且在壳体内滑动 弹性地为了允许更多的行进和顺应性而不产生屈曲或使梁完全变形。 变形期间的滑动动作有效地将上述组件中的总顺从性超越了悬臂梁的弹性压缩可用的顺从性。

    Moulding material
    8.
    发明授权
    Moulding material 有权
    成型材料

    公开(公告)号:US08101106B2

    公开(公告)日:2012-01-24

    申请号:US11879378

    申请日:2007-07-16

    Applicant: John Ellis

    Inventor: John Ellis

    Abstract: Molding material that includes a layer of fibrous reinforcing material having one surface on which a first layer of a resin partially impregnates the fibrous material and a further resin layer located on the opposite surface which retains in position surface fibers of the fibrous material. The further resin layer is of lower weight than the first layer and is formed as an openwork structure with a solid part and spaces through which the fibrous material is exposed.

    Abstract translation: 模制材料包括一层纤维增强材料,该层具有一个表面,第一层树脂部分浸渍在纤维材料上,另外一个树脂层位于相对表面上,该树脂层保持纤维材料的表面纤维的位置。 另外的树脂层的重量比第一层重,并且形成为具有固体部分和空间的镂空结构,纤维材料通过该空间露出。

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