Invention Grant
- Patent Title: Relay substrate and substrate assembly
- Patent Title (中): 继电器基板和基板组件
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Application No.: US12010878Application Date: 2008-01-30
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Publication No.: US07696628B2Publication Date: 2010-04-13
- Inventor: Tadashi Ikeuchi , Takatoshi Yagisawa , Tszshing Cheung
- Applicant: Tadashi Ikeuchi , Takatoshi Yagisawa , Tszshing Cheung
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Staas & Halsey LLP
- Priority: JP2007-021808 20070131
- Main IPC: H01L23/48
- IPC: H01L23/48

Abstract:
According to an aspect of an embodiment, a substrate for connecting circuit boards comprises: a substrate member having a first surface and a second surface facing each other and a first end and a second end facing each other; a first signal line formed on the first surface of the first end; a second signal line formed on the second surface of the second end; a third signal line connecting the first signal line with the second signal line; a first ground plane arranged on the first surface and surrounding the first signal line; and a portion of the second signal line formed over the first ground, the portion comprising narrower than an other portion of the second signal line.
Public/Granted literature
- US20090029570A1 Relay substrate and substrate assembly Public/Granted day:2009-01-29
Information query
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