发明授权
- 专利标题： Relay substrate and substrate assembly
- 专利标题（中）： 继电器基板和基板组件
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申请号： US12010878申请日： 2008-01-30
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公开(公告)号： US07696628B2公开(公告)日： 2010-04-13
- 发明人: Tadashi Ikeuchi , Takatoshi Yagisawa , Tszshing Cheung
- 申请人： Tadashi Ikeuchi , Takatoshi Yagisawa , Tszshing Cheung
- 申请人地址： JP Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JP Kawasaki
- 代理机构： Staas & Halsey LLP
- 优先权： JP2007-021808 20070131
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
According to an aspect of an embodiment, a substrate for connecting circuit boards comprises: a substrate member having a first surface and a second surface facing each other and a first end and a second end facing each other; a first signal line formed on the first surface of the first end; a second signal line formed on the second surface of the second end; a third signal line connecting the first signal line with the second signal line; a first ground plane arranged on the first surface and surrounding the first signal line; and a portion of the second signal line formed over the first ground, the portion comprising narrower than an other portion of the second signal line.
公开/授权文献
- US20090029570A1 Relay substrate and substrate assembly 公开/授权日：2009-01-29
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