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公开(公告)号：US07443279B2
公开(公告)日：2008-10-28
申请号：US11366625
申请日：2006-03-03
CPC分类号： H01F5/00 , H01F27/027 , H01F2005/006 , H01Q1/36 , H01Q19/09 , H05K1/0243
摘要： A coil package which makes it easy to handle a high-frequency cone/pyramid-shaped coil and enhance frequency characteristics without degrading the characteristics of the coil. The cone/pyramid-shaped coil has a conical or pyramidal shape formed by wiring a conductor wire around an outer peripheral surface of a core such that the winding diameter of the coil progressively decreases from one end to the other end of the coil. The coil and a dielectric substrate are integrated with each other by forming a hole for inserting a tip portion of the coil in the dielectric substrate, making the bottom of the hole and a back surface of the dielectric substrate electrically continuous by a via, placing the coil in the hole by directing a small-diameter side of the cone/pyramid-shaped coil to the hole, electrically connecting the bottom of the hole and a tip-side lead wire extending from the coil to each other, and connecting an electrode on a large-diameter side of the coil to an electrode on the dielectric substrate.
摘要翻译： 一种线圈封装，使其易于处理高频锥/棱锥形线圈并增强频率特性，而不会降低线圈的特性。 锥形/棱锥形线圈具有锥形或棱锥形状，其通过将导体线布置在芯的外周表面上而形成，使得线圈的卷绕直径从线圈的一端逐渐减小到另一端。 线圈和电介质基板通过形成用于将线圈的尖端部分插入电介质基板的孔而彼此一体化，使得孔的底部和电介质基板的后表面通过通孔电连续， 通过将锥形/锥体形的线圈的小直径侧引导到孔中，将孔的底部电连接到彼此的线圈和从线圈延伸的尖端侧引线，并将电极 线圈的大直径侧到电介质基板上的电极。
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公开(公告)号：US07696628B2
公开(公告)日：2010-04-13
申请号：US12010878
申请日：2008-01-30
IPC分类号： H01L23/48
CPC分类号： H01P1/047 , H01L24/73 , H01L2224/48091 , H01L2924/12041 , H01L2924/14 , H01L2924/15787 , H05K1/0219 , H05K1/117 , H05K1/141 , H05K1/147 , H05K2201/09618 , H05K2201/09727 , H05K2201/10121 , H05K2201/10446 , H01L2924/00014 , H01L2924/00
摘要： According to an aspect of an embodiment, a substrate for connecting circuit boards comprises: a substrate member having a first surface and a second surface facing each other and a first end and a second end facing each other; a first signal line formed on the first surface of the first end; a second signal line formed on the second surface of the second end; a third signal line connecting the first signal line with the second signal line; a first ground plane arranged on the first surface and surrounding the first signal line; and a portion of the second signal line formed over the first ground, the portion comprising narrower than an other portion of the second signal line.
摘要翻译： 根据实施例的一个方面，一种用于连接电路板的基板包括：具有彼此面对的第一表面和第二表面以及彼此相对的第一端和第二端的基板构件; 形成在第一端的第一表面上的第一信号线; 形成在第二端的第二表面上的第二信号线; 连接所述第一信号线与所述第二信号线的第三信号线; 布置在第一表面上并围绕第一信号线的第一接地平面; 以及形成在第一接地上的第二信号线的一部分，该部分包括比第二信号线的另一部分窄的部分。
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公开(公告)号：US20070164843A1
公开(公告)日：2007-07-19
申请号：US11366625
申请日：2006-03-03
IPC分类号： H01F27/02
CPC分类号： H01F5/00 , H01F27/027 , H01F2005/006 , H01Q1/36 , H01Q19/09 , H05K1/0243
摘要： A coil package which makes it easy to handle a high-frequency cone/pyramid-shaped coil and enhance frequency characteristics without degrading the characteristics of the coil. The cone/pyramid-shaped coil has a conical or pyramidal shape formed by wiring a conductor wire around an outer peripheral surface of a core such that the winding diameter of the coil progressively decreases from one end to the other end of the coil. The coil and a dielectric substrate are integrated with each other by forming a hole for inserting a tip portion of the coil in the dielectric substrate, making the bottom of the hole and a back surface of the dielectric substrate electrically continuous by a via, placing the coil in the hole by directing a small-diameter side of the cone/pyramid-shaped coil to the hole, electrically connecting the bottom of the hole and a tip-side lead wire extending from the coil to each other, and connecting an electrode on a large-diameter side of the coil to an electrode on the dielectric substrate.
摘要翻译： 一种线圈封装，使其易于处理高频锥/棱锥形线圈并增强频率特性，而不会降低线圈的特性。 锥形/棱锥形线圈具有锥形或棱锥形状，其通过将导体线布置在芯的外周表面上而形成，使得线圈的卷绕直径从线圈的一端逐渐减小到另一端。 线圈和电介质基板通过形成用于将线圈的尖端部分插入电介质基板的孔而彼此一体化，使得孔的底部和电介质基板的后表面通过通孔电连续， 通过将锥形/锥体形的线圈的小直径侧引导到孔中，将孔的底部电连接到彼此的线圈和从线圈延伸的尖端侧引线，并将电极 线圈的大直径侧到电介质基板上的电极。
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公开(公告)号：US20090029570A1
公开(公告)日：2009-01-29
申请号：US12010878
申请日：2008-01-30
IPC分类号： H01R12/12
CPC分类号： H01P1/047 , H01L24/73 , H01L2224/48091 , H01L2924/12041 , H01L2924/14 , H01L2924/15787 , H05K1/0219 , H05K1/117 , H05K1/141 , H05K1/147 , H05K2201/09618 , H05K2201/09727 , H05K2201/10121 , H05K2201/10446 , H01L2924/00014 , H01L2924/00
摘要： According to an aspect of an embodiment, a substrate for connecting circuit boards comprises: a substrate member having a first surface and a second surface facing each other and a first end and a second end facing each other; a first signal line formed on the first surface of the first end; a second signal line formed on the second surface of the second end; a third signal line connecting the first signal line with the second signal line; a first ground plane arranged on the first surface and surrounding the first signal line; and a portion of the second signal line formed over the first ground, the portion comprising narrower than an other portion of the second signal line.
摘要翻译： 根据实施例的一个方面，用于连接电路板的基板包括：具有彼此面对的第一表面和第二表面的基板构件和彼此面对的第一端和第二端; 形成在第一端的第一表面上的第一信号线; 形成在第二端的第二表面上的第二信号线; 连接所述第一信号线与所述第二信号线的第三信号线; 布置在第一表面上并围绕第一信号线的第一接地平面; 以及形成在第一接地上的第二信号线的一部分，该部分包括比第二信号线的另一部分窄的部分。
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公开(公告)号：US07436056B2
公开(公告)日：2008-10-14
申请号：US11456870
申请日：2006-07-12
CPC分类号： H01L23/50 , H01L23/10 , H01L23/13 , H01L23/49822 , H01L23/49838 , H01L23/66 , H01L24/48 , H01L24/49 , H01L2223/6616 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/48227 , H01L2224/49175 , H01L2924/00014 , H01L2924/01019 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15174 , H01L2924/15311 , H01L2924/16152 , H01L2924/1617 , H01L2924/19051 , H01L2924/3011 , H01L2924/30111 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electronic component package includes a dielectric substrate having a first surface where an electronic component is sealed. A first signal line connecting to the electronic component and a first ground conductor are formed on the first surface of the dielectric substrate. A second signal line connected to an outside connection electrode and a second ground conductor are formed on a second surface of the dielectric substrate. The first ground conductor and the second ground conductor are connected by a plurality of ground conductor via-holes. A substrate-buried signal line connected to the first signal line and the second signal line is provided inside of the dielectric substrate so as to be put between the first ground conductor and the second ground conductor above and below and between the ground conductor via-holes on the right and left.
摘要翻译： 电子部件封装包括电介质基板，其具有电子部件被密封的第一表面。 连接到电子部件的第一信号线和第一接地导体形成在电介质基板的第一表面上。 连接到外部连接电极和第二接地导体的第二信号线形成在电介质基板的第二表面上。 第一接地导体和第二接地导体通过多个接地导体通孔连接。 连接到第一信号线和第二信号线的衬底埋入信号线设置在电介质衬底的内部，以便放置在第一接地导体和第二接地导体之间和之下并且在接地导体通孔之间 在右边和左边。
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公开(公告)号：US20070241447A1
公开(公告)日：2007-10-18
申请号：US11456870
申请日：2006-07-12
IPC分类号： H01L23/12
CPC分类号： H01L23/50 , H01L23/10 , H01L23/13 , H01L23/49822 , H01L23/49838 , H01L23/66 , H01L24/48 , H01L24/49 , H01L2223/6616 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/48227 , H01L2224/49175 , H01L2924/00014 , H01L2924/01019 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15174 , H01L2924/15311 , H01L2924/16152 , H01L2924/1617 , H01L2924/19051 , H01L2924/3011 , H01L2924/30111 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electronic component package includes a dielectric substrate having a first surface where an electronic component is sealed. A first signal line connecting to the electronic component and a first ground conductor are formed on the first surface of the dielectric substrate. A second signal line connected to an outside connection electrode and a second ground conductor are formed on a second surface of the dielectric substrate. The first ground conductor and the second ground conductor are connected by a plurality of ground conductor via-holes. A substrate-buried signal line connected to the first signal line and the second signal line is provided inside of the dielectric substrate so as to be put between the first ground conductor and the second ground conductor above and below and between the ground conductor via-holes on the right and left.
摘要翻译： 电子部件封装包括电介质基板，其具有电子部件被密封的第一表面。 连接到电子部件的第一信号线和第一接地导体形成在电介质基板的第一表面上。 连接到外部连接电极和第二接地导体的第二信号线形成在电介质基板的第二表面上。 第一接地导体和第二接地导体通过多个接地导体通孔连接。 连接到第一信号线和第二信号线的衬底埋入信号线设置在电介质衬底的内部，以便放置在第一接地导体和第二接地导体之间和之下并且在接地导体通孔之间 在右边和左边。
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公开(公告)号：US08491316B2
公开(公告)日：2013-07-23
申请号：US13561138
申请日：2012-07-30
IPC分类号： H01R13/00
摘要： A lead terminal includes signal lead pins and GND lead pins. The signal lead pin connects one signal pattern on a flexible substrate and another signal pattern on a rigid substrate. The GND lead pin connects one GND pattern on the flexible substrate and another GND pattern in the rigid substrate. A holding member has an insulating property and holds pairs of the signal lead pins and the GND lead pins at a distance. One main part of the signal lead pin and another main part of the GND lead pin form a microstrip line structure.
摘要翻译： 引线端子包括信号引脚引脚和GND引脚引脚。 信号引线引脚将柔性基板上的一个信号图案和刚性基板上的另一个信号图案连接起来。 GND引脚将柔性基板上的一个GND图案和刚性基板中的另一个GND图案连接起来。 保持构件具有绝缘性能并且保持一定距离的信号引线引脚和GND引脚引脚。 信号引脚的一个主要部分和GND引脚的另一个主要部分形成微带线结构。
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公开(公告)号：US20110294308A1
公开(公告)日：2011-12-01
申请号：US13115322
申请日：2011-05-25
CPC分类号： H01R12/714 , G02B6/4279 , G02B6/4281 , H01R12/62 , H05K1/0243 , H05K1/0245 , H05K1/0274 , H05K1/189 , H05K2201/10121 , H05K2201/1053
摘要： There is provided a substrate that includes a base substrate, a socket that has a step where the step has a first surface and a second surface, the socket being electrically coupled with the base substrate at the first surface; and a connection substrate that is disposed between the second surface and the base substrate, where the connection substrate is electrically coupled with the socket at the second surface.
摘要翻译： 提供了一种基板，其包括基底基板，具有该台阶具有第一表面和第二表面的台阶的插座，所述插座在所述第一表面处与所述基底基板电耦合; 以及连接基板，其设置在所述第二表面和所述基底基板之间，其中所述连接基板在所述第二表面处与所述插座电耦合。
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公开(公告)号：US20080289862A1
公开(公告)日：2008-11-27
申请号：US12222115
申请日：2008-08-01
IPC分类号： H05K1/00
CPC分类号： H01L23/4985 , G02B6/4201 , H01L23/057 , H01L23/66 , H01L2223/6627 , H01L2224/16 , H01L2224/32188 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/15153 , H01L2924/1517 , H01L2924/1903 , H01L2924/3011 , H05K1/0243 , H05K1/189 , H01L2224/0401
摘要： An electronic component package includes a film board where an electronic component is mounted, and a lid part mounted on the film board so as to cover a surface of the film board. The electronic component is provided in a cavity formed by the film board and the lid part, and the electronic component is connected to a signal wiring conductor formed at the film board.
摘要翻译： 电子部件封装包括安装电子部件的薄膜基板和安装在薄膜基板上以覆盖薄膜基板的表面的盖部。 电子部件设置在由薄膜基板和盖部形成的空腔中，电子部件与形成在薄膜基板上的信号布线导体连接。
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公开(公告)号：US07046100B2
公开(公告)日：2006-05-16
申请号：US10944181
申请日：2004-09-20
CPC分类号： H01P1/203 , H01P1/2013 , H05K1/0231 , H05K1/0239 , H05K1/184 , H05K3/4092 , H05K2201/0397 , H05K2201/09481 , H05K2201/1053 , H05K2201/10545 , H05K2201/10636 , H05K2201/10643 , Y02P70/611
摘要： In the direct current cut structure of the present invention, two capacitors are provided in parallel between signal transmission line patterns facing each other on a substrate, and each of the two capacitors is electrically connected to each surface of each transmission line pattern that is exposed through a hole part provided on the substrate. It is preferable for the two capacitors to have different capacity. If there is no need to cover such a broad band, only one capacitor can also connected to either side of each transmission line pattern exposed through the hole part.
摘要翻译： 在本发明的直流切断结构中，在基板上彼此面对的信号传输线图案之间并联设置两个电容器，并且两个电容器中的每一个电连接到每个传输线图案的暴露于 设置在基板上的孔部。 两个电容器的电容最好具有不同的容量。 如果不需要覆盖这样的宽带，则只有一个电容器也可以连接到通过孔部分暴露的每个传输线图案的任一侧。
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