发明授权
- 专利标题: Pressure sensing device
- 专利标题(中): 压力传感装置
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申请号: US11861119申请日: 2007-09-25
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公开(公告)号: US07698952B2公开(公告)日: 2010-04-20
- 发明人: Wayne G. Renken , Mei H. Sun , Aron Abramowski Mason , Lynn Karl Wiese
- 申请人: Wayne G. Renken , Mei H. Sun , Aron Abramowski Mason , Lynn Karl Wiese
- 申请人地址: US CA San Jose
- 专利权人: KLA-Tencor Corporation
- 当前专利权人: KLA-Tencor Corporation
- 当前专利权人地址: US CA San Jose
- 代理机构: JDI Patent
- 代理商 Joshua D. Isenberg
- 主分类号: G01L1/00
- IPC分类号: G01L1/00
摘要:
At least one pair of capacitively coupled electrodes contained in a structure is used to sense the deflection of a diaphragm in a pressure or force sensor for measuring the pressure or force exerted on the diaphragm. Preferably the structure has properties (such as one or more of the following: dimensions, hardness, area and flexibility) that are substantially the same as those of a real substrate, such as a semiconductor wafer or flat panel display panel.
公开/授权文献
- US20080087069A1 Pressure Sensing Device 公开/授权日:2008-04-17
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