摘要:
A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device.
摘要:
The flow meter (10), particularly useful in monitoring flow in semiconductor manufacturing operations, measures mass flow rate of fluids and is fabricated by providing spaced webs (16) deposited on a silicon substrate (11) and fluid flow grooves (13) etched across a substrate surface and extending under the spaced webs. The webs 16 include a low thermal conductivity layer deposited in spaced aligned portions of the substrate and electrically resistive pathways deposited on the layer portions (61). The webs act as temperature sensors and/or heaters. Heat is added to the flowing fluid and a differential temperature is measured on a bridge circuit as is known in the art to measure flow rate. A cover (12) has etched grooves (14a) which match the grooves (13) of the substrate to form a fluid passageway in which the web bisects the passageway forming an "air-foil" like bridging member extending completely across (or cantilevered across) in transverse relation to the flat sides of the substrate on either side of the groove. Normally multiple series of webs and multiple grooves are employed to provide redundancy of the flow meter channels in the event contaminants plug a particular channel.
摘要:
An instrument for measuring a parameter comprises a substrate, a plurality of sensors carried by and distributed across a surface of the substrate that individually measure the parameter at different positions, an electronic processing component carried by the substrate surface, electrical conductors extending across the surface connected to the sensors and the electronic processing component, and a cover disposed over the sensors, electronic processing component and conductors. The cover and substrate have similar material properties to a production substrate processed by a substrate processing cell. The instrument has approximately the same thickness and/or flatness as the production substrate. The instrument may be subjected a substrate process and one or more parameters may be measured with the instrument during the process. The behavior of a production wafer in the substrate process may be characterized based on measurements of the parameters made with the one or more sensors.
摘要:
A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device. Isolation may be provided by vacuum or suitable material and phase change material may be located adjacent to electronics to maintain a low temperature.
摘要:
An instrument for measuring a parameter comprises a substrate, a plurality of sensors carried by and distributed across a surface of the substrate that individually measure the parameter at different positions, an electronic processing component carried by the substrate surface, electrical conductors extending across the surface connected to the sensors and the electronic processing component, and a cover disposed over the sensors, electronic processing component and conductors. The cover and substrate have similar material properties to a production substrate processed by a substrate processing cell. The instrument has approximately the same thickness and/or flatness as the production substrate. The instrument may be subjected a substrate process and one or more parameters may be measured with the instrument during the process. The behavior of a production wafer in the substrate process may be characterized based on measurements of the parameters made with the one or more sensors.
摘要:
At least one shear force sensor is used to measure the shear force on a member, when the member is in contact with and pressed against a polishing or planarization surface and a lateral force is applied between the two surfaces. Preferably the structure and the surface of the structure have properties (such as one or more of the following: dimensions and coefficient of friction) that are substantially the same as those of a real substrate, such as a semiconductor wafer or flat panel display panel.
摘要:
A mass flowmeter and controller measures the mass flow rate of liquid or gaseous fluids and controls the flow rate of the fluids being utilized in a processing operation. A series of flow channels and blocked channels are micro-etched from a silicon substrate leaving an integral membrane suspended across the channels. A heater-sensor thin film resistor, diode or transistor is formed on the membranes and the substrate during manufacture to sense the temperature at particular locations. A cover housing matching channels and grooves forms flow and stagnant blocked conduits in the structure. Through a bridge circuit a signal indicative of mass flow is produced. This signal is passed to a control valve armature coil in an in-line flow control valve. The controller includes a sensor module containing monitored flow and blocked channels and passive by-pass channels as required for additional flow capacity, a control valve cartridge, an overall housing and the magnetic armature coil which controls the flow of fluid through the valve and the sensor module.
摘要:
A corrosion resistant electrical interconnect system has a flexible circuit with buried conductor patterns in an insulative film coating which is juxtaposed to a feed-through connector having inlet/outlet electrical contact pins therethrough. Sharp ends are present on the pins which pierce the insulative film and permit spot welding of the pin tips to portions of the conductor pattern. Other portions of the conductor pattern extend exteriorly of the flexible circuit and are electrically connected on to bond pads of an integrated circuit chip such as a sensor chip utilized in a mass flow meter.
摘要:
An instrument comprises a substrate, a plurality of sensors distributed at positions across the substrate's surface, at least one electronic processing component on the surface, electrical conductors extending across the surface and connected to the sensors and processing component, and a cover disposed over the sensors, processing component and conductors. The cover and substrate have similar material properties to a production substrate. The cover is configured to electromagnetically shield the sensors, conductors, or processing component. The instrument has approximately the same thickness and/or flatness as the production substrate. It is emphasized that this abstract is provided to comply with rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
摘要:
A sensor network collects time-series data from a process tool and supplies the data to an analysis system where pattern analysis techniques are used to identify structures and to monitor subsequent data based on analysis instructions or a composite model. Time-series data from multiple process runs are used to form a composite model of a data structure including variation. Comparison with the composite model gives an indication of tool health. A sensor network may have distributed memory for a more simplified configuration.