发明授权
- 专利标题： On-chip heater and methods for fabrication thereof and use thereof
- 专利标题（中）： 片上加热器及其制造方法及其应用
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申请号： US11419341申请日： 2006-05-19
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公开(公告)号： US07704847B2公开(公告)日： 2010-04-27
- 发明人: Ethan H. Cannon , Alvin W. Strong
- 申请人： Ethan H. Cannon , Alvin W. Strong
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Scully, Scott, Murphy & Presser, P.C.
- 代理商 Richard M. Kotulak, Esq.
- 主分类号： H01L21/762
- IPC分类号： H01L21/762
摘要：
An on-chip heater and methods for fabrication thereof and use thereof provide that the heater is located within an isolation region that in turn is located within a semiconductor substrate. The heater has a thermal output capable or raising the semiconductor substrate to a temperature of at least about 200° C. The heater may be used for thermally annealing trapped charges within dielectric layers within the semiconductor structure.
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