摘要:
Each one of a pair of CMOS transistors is formed in its own island and a gate terminal for each transistor is formed by a single, in-line conductor connecting both gate terminals together. This type of “in-line” connection achieves nearly a five-time improvement in the reduction of the ability of ionizing radiation particles to strike both transistors at the same time as compared to prior art “side-by-side” transistor stacking through use of a relatively smaller solid angle spanning the two transistors. This results in “hardening” of the transistors and improving their resistance to single event upsets and, thus, improving the soft error rate (SER) of the transistors.
摘要:
A method of determining one or more transistors within a particular circuit to be respectively replaced with a hardened transistor includes: identifying, as not requiring hardening, one or more transistors; identifying, as candidates for hardening, each transistor in the circuit not previously identified as not requiring hardening; and employing the hardened transistor in place of a transistor identified as a candidate for hardening. The circuit is a latch and the transistor is an SOI CMOS FET. The transistor is also an SOI transistor. The series transistor includes first and second series-connected transistors having a shared source/drain region whereby a drain of the first series-connected transistor is merged with a source of the second series-connected transistor.
摘要:
An array of radiation sensors or detectors is integrated within a three-dimensional semiconductor IC. The sensor array is located relatively close to the device layer of a circuit (e.g., a microprocessor) to be protected from the adverse effects of the ionizing radiation particles. As such, the location where the radiation particles intersect the device layer can be calculated with coarse precision (e.g., to within 10 s of microns).
摘要:
An array of radiation sensors or detectors is integrated within a three-dimensional semiconductor IC. The sensor array is located relatively close to the device layer of a circuit (e.g., a microprocessor) to be protected from the adverse effects of the ionizing radiation particles. As such, the location where the radiation particles intersect the device layer can be calculated with coarse precision (e.g., to within 10 s of microns).
摘要:
The different advantageous embodiments provide an integrated circuit comprising a number of latches and a number of filters. Each latch in the number of latches has a plurality of inputs and a plurality of storage nodes. The plurality of storage nodes includes a number of pairs of circuit nodes that form a number of upsettable circuit node pairs. Each input of the plurality of inputs is connected to a corresponding storage node in the plurality of storage nodes. Each filter in the number of filters has an input and a plurality of outputs. Each of the plurality of outputs is connected to a corresponding input of the plurality of inputs of a latch in the number of latches. Each filter in the number of filters is located between two circuit nodes forming an upsettable circuit node pair of the latch in the number of latches to increase critical node spacing.
摘要:
A method of determining one or more transistors within a particular circuit to be respectively replaced with a hardened transistor includes: identifying, as not requiring hardening, one or more transistors; identifying, as candidates for hardening, each transistor in the circuit not previously identified as not requiring hardening; and employing the hardened transistor in place of a transistor identified as a candidate for hardening. The circuit is a latch and the transistor is an SOI CMOS FET. The transistor is also an SOI transistor. The series transistor includes first and second series-connected transistors having a shared source/drain region whereby a drain of the first series-connected transistor is merged with a source of the second series-connected transistor.
摘要:
Each one of a pair of CMOS transistors is formed in its own island and a gate terminal for each transistor is formed by a single, in-line conductor connecting both gate terminals together. This type of “in-line” connection achieves nearly a five-time improvement in the reduction of the ability of ionizing radiation particles to strike both transistors at the same time as compared to prior art “side-by-side” transistor stacking through use of a relatively smaller solid angle spanning the two transistors. This results in “hardening” of the transistors and improving their resistance to single event upsets and, thus, improving the soft error rate (SER) of the transistors.
摘要:
A test setup for estimating the critical charge of a circuit under test (CUT) uses a charge injection circuit having a switched capacitor that is selectively connected to a node of the CUT. A voltage measurement circuit measures the voltage at a tap in the charge injection circuit before and after the charge is injected. When the injected charge causes an upset in the logical state of the CUT, the critical charge is calculated as the product of the voltage difference and the known capacitance of the capacitor. In one embodiment, (NMOS drain strike simulation) the amount of charge injected is controlled by a variable pulse width generator gating the switch of the charge injection circuit. In another embodiment (PMOS drain strike simulation) the amount of charge injected is controlled by a variable voltage supply selectively connected to the charge storage node.
摘要:
The invention relates to a design structure, and more particularly, to a design structure for an alpha particle sensor in SOI technology and a circuit thereof. The structure is a silicon-on-insulator radiation detector which includes: a charge collection node; a precharge transistor that has a source from the charge collection node, a drain at Vdd, and a gate controlled by a precharge signal; an access transistor that has a source from the charge collection node, a drain connecting to a readout node, and a gate controlled by a read-out signal; and a detector pulldown transistor having a drain from the charge collection node, a source to ground, and a grounded gate.
摘要:
Novel semiconductor structures and methods are disclosed for forming a buried recombination layer underneath the bulk portion of a hybrid orientation technology by implanting at least one recombination center generating element to reduce single event upset rates in CMOS devices thereabove. The crystalline defects in the buried recombination layer caused by the recombination center generating elements are not healed even after a high temperature anneal and serve as recombination centers where holes and electrons generated by ionizing radiation are collected by. Multiple buried recombination layers may be formed. Optionally, one such layer may be biased with a positive voltage to prevent latchup by collecting electrons.