发明授权
- 专利标题： Electronic components produced by a method of separating two layers of material from one another
- 专利标题（中）： 通过将两层材料彼此分离的方法产生的电子部件
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申请号： US12075599申请日： 2008-03-11
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公开(公告)号： US07713840B2公开(公告)日： 2010-05-11
- 发明人: Michael Kelly , Oliver Ambacher , Martin Stutzmann , Martin Brandt , Roman Dimitrov , Robert Handschuh
- 申请人： Michael Kelly , Oliver Ambacher , Martin Stutzmann , Martin Brandt , Roman Dimitrov , Robert Handschuh
- 申请人地址： DE München
- 专利权人： Osram GmbH
- 当前专利权人： Osram GmbH
- 当前专利权人地址： DE München
- 代理机构： Cohen Pontani Lieberman & Pavane LLP
- 优先权： DE19640594 19961001
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A semiconductor body selected from the group consisting of a semiconductor layer, a semiconductor layer sequence or a semiconductor layer structure. The semiconductor body is transferred from a growth substrate to a support material by: exposing an interface between the growth substrate and the semiconductor body or a region in the vicinity of said interface to electromagnetic radiation through one of the semiconductor body and the growth substrate; decomposing a material at or in proximity to said interface by absorption of the electromagnetic radiation in proximity to or at said interface so that the semiconductor body can be separated from the growth substrate; and connecting the semiconductor body to the support material.