发明授权
- 专利标题： Structure and method for producing multiple size interconnections
- 专利标题（中）： 用于生产多尺寸互连的结构和方法
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申请号： US11847776申请日： 2007-08-30
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公开(公告)号： US07714452B2公开(公告)日： 2010-05-11
- 发明人: Lawrence A. Clevenger , Mukta Ghate Farooq , Louis Lu-Chen Hsu , William Francis Landers , Donna S. Zupanski-Nielson , Carl John Radens , Chih-Chao Yang
- 申请人： Lawrence A. Clevenger , Mukta Ghate Farooq , Louis Lu-Chen Hsu , William Francis Landers , Donna S. Zupanski-Nielson , Carl John Radens , Chih-Chao Yang
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Schmeiser, Olsen & Watts
- 代理商 Steven Capella
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L21/44
摘要：
An electrical structure and method comprising a first substrate electrically and mechanically connected to a second substrate. The first substrate comprises a first electrically conductive pad and a second electrically conductive pad. The second substrate comprises a third electrically conductive pad, a fourth electrically conductive pad, and a first electrically conductive member. The fourth electrically conductive pad comprises a height that is different than a height of the first electrically conductive member. The electrically conductive member is electrically and mechanically connected to the fourth electrically conductive pad. A first solder ball connects the first electrically conductive pad to the third electrically conductive pad. The first solder ball comprises a first diameter. A second solder ball connects the second electrically conductive pad to the first electrically conductive member. The second solder ball comprises a second diameter. The first diameter is greater than said second diameter.
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