发明授权
- 专利标题: Electronic component mounting method
- 专利标题(中): 电子元件安装方法
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申请号: US11340866申请日: 2006-01-27
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公开(公告)号: US07721424B2公开(公告)日: 2010-05-25
- 发明人: Akira Aoki , Makio Kameda , Yoshiharu Fukushima , Katsuyuki Seto , Hideaki Fukushima
- 申请人: Akira Aoki , Makio Kameda , Yoshiharu Fukushima , Katsuyuki Seto , Hideaki Fukushima
- 申请人地址: JP Gunma
- 专利权人: Hitachi High-Tech Instruments Co., Ltd.
- 当前专利权人: Hitachi High-Tech Instruments Co., Ltd.
- 当前专利权人地址: JP Gunma
- 代理机构: Morrison & Foerster LLP
- 优先权: JP2005-021957 20050128
- 主分类号: H05K3/30
- IPC分类号: H05K3/30
摘要:
The invention is directed to prevention of interference of an operation of mounting proper electronic components and improvement of usability without reduction of a manufacturing speed of printed boards. Suction states of electronic components held by suction by suction nozzles are detected by a line sensor unit. When the detection result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal a component recognition camera takes images of electronic components judged proper as a result of the detection and a recognition processing device performs a recognition process. When the recognition result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal only electronic components judged proper as a result of the recognition are mounted on a printed board.
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