发明授权
- 专利标题： Adhesive compositions for flexible circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof
- 专利标题（中）： 用于柔性电路材料的粘合剂组合物，电路，多层电路及其制造方法
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申请号： US11559637申请日： 2006-11-14
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公开(公告)号： US07722950B2公开(公告)日： 2010-05-25
- 发明人: David Guo , Carlos L. Barton
- 申请人： David Guo , Carlos L. Barton
- 申请人地址： US IL Lincolnwood
- 专利权人： World Properties, Inc.
- 当前专利权人： World Properties, Inc.
- 当前专利权人地址： US IL Lincolnwood
- 代理机构： Cantor Colburn LLP
- 主分类号： B32B7/12
- IPC分类号： B32B7/12
摘要：
An adhesive for a circuit material, comprises a blend of a cure system; and a solid epoxy resin and a nitrile rubber functionalized with epoxy-reactive groups, wherein the solid epoxy resin and the nitrile rubber are reacted to form an adduct prior to blending with the cure system. The adhesive has low dendritic growth and improved solder resistance.
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