发明授权
- 专利标题: Thermal interface material and method of producing the same
- 专利标题(中): 热界面材料及其制造方法
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申请号: US11309896申请日: 2006-10-24
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公开(公告)号: US07728052B2公开(公告)日: 2010-06-01
- 发明人: Ching-Tai Cheng , Nien-Tien Cheng
- 申请人: Ching-Tai Cheng , Nien-Tien Cheng
- 申请人地址: TW Tu-Cheng, Taipei Hsien
- 专利权人: Foxconn Technology Co., Ltd.
- 当前专利权人: Foxconn Technology Co., Ltd.
- 当前专利权人地址: TW Tu-Cheng, Taipei Hsien
- 代理商 Jeffrey T. Knapp
- 优先权: CN200610033261 20060121
- 主分类号: C08K3/22
- IPC分类号: C08K3/22
摘要:
A thermal interface material (10) includes 100 parts by weight of a silicone oil (11) and 800˜1200 parts by weight of a metal powder (12) mixed into the silicone oil. An outer surface of each metal particle (121) of the metal powder is coated with a metal oxide layer (122). A method of producing the thermal interface material includes steps of: (1) applying a layer of organo coupling agent on the metal powder; (2) heating the metal powder at a temperature between 200 to 300° C. to coat a metal oxide layer on an outer surface of the metal powder; and (3) adding the metal powder with the coated metal oxide layer to a silicone oil. The thermal interface material has an excellent thermal conductivity and an excellent electrical insulating property.
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