发明授权
US07736749B2 Thermosetting resin composition, resin film, metallic foil provided with an insulation material, insulation film provided with a metallic foil on each side, metal-clad laminate, multi-layered metal-clad laminate, and multi-layered printed wiring board
有权
热固性树脂组合物,树脂膜,设置有绝缘材料的金属箔,在每一侧设置有金属箔的绝缘膜,覆金属层压板,多层金属覆层压板和多层印刷线路板
- 专利标题: Thermosetting resin composition, resin film, metallic foil provided with an insulation material, insulation film provided with a metallic foil on each side, metal-clad laminate, multi-layered metal-clad laminate, and multi-layered printed wiring board
- 专利标题(中): 热固性树脂组合物,树脂膜,设置有绝缘材料的金属箔,在每一侧设置有金属箔的绝缘膜,覆金属层压板,多层金属覆层压板和多层印刷线路板
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申请号: US11537122申请日: 2006-09-29
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公开(公告)号: US07736749B2公开(公告)日: 2010-06-15
- 发明人: Hideo Baba , Nozomu Takano , Kazuhiro Miyauchi
- 申请人: Hideo Baba , Nozomu Takano , Kazuhiro Miyauchi
- 申请人地址: JP Tokyo
- 专利权人: Hitachi Chemichal Co., Ltd.
- 当前专利权人: Hitachi Chemichal Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Greenblum & Bernstein, P.L.C.
- 优先权: JPP2000-101228 20000331; JPP2000-244573 20000811; JPP2000-399796 20001228
- 主分类号: B32B15/08
- IPC分类号: B32B15/08 ; C08L83/04 ; C08L83/05 ; C08L83/06 ; C08L83/07 ; C08K3/00
摘要:
A process for producing a silicone polymer comprising a step of subjecting, to hydrolysis and polycondensation reaction, a silane compound mixture containing 35 to 100% by mol of a silane compound represented by the general formula (I): R′m(H)kSiX4−(m+k) (I) (wherein X is a hydrolysable and polycondensable group, e.g., a halogen atom (e.g., chlorine or bromine) or —OR; R is an alkyl group of 1 to 4 carbon atoms or an alkyl carbonyl group of 1 to 4 carbon atoms; R′ is a non-reactive group, e.g., an alkyl group of 1 to 4 carbon atoms or an aryl group (e.g., a phenyl group); “k” is 1 or 2; “m” is 0 or 1; and “m+k” is 1 or 2), and further subjecting the resultant product to hydrosilylation reaction with a hydrosilylation agent.
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