发明授权
- 专利标题: Semiconductor device and manufacturing method thereof
- 专利标题(中): 半导体装置及其制造方法
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申请号: US11889420申请日: 2007-08-13
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公开(公告)号: US07737466B1公开(公告)日: 2010-06-15
- 发明人: Kaoru Hiyama , Tomoya Sanuki , Osamu Fujii
- 申请人: Kaoru Hiyama , Tomoya Sanuki , Osamu Fujii
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Foley & Lardner LLP
- 优先权: JP2004-001075 20040106
- 主分类号: H01L29/06
- IPC分类号: H01L29/06 ; H01L35/26
摘要:
A semiconductor device includes a substrate having a first area and a second area adjacent to the first area, a first silicon layer provided on the substrate in the first area, a relaxed layer which is provided on the substrate in the second area and which has a lattice constant greater than a lattice constant of the first silicon layer, and a strained-Si layer which is provided on the relaxed layer and which has a lattice constant substantially equivalent to the lattice constant of the relaxed layer.
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