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    THERMOELECTRIC ELEMENTS AND DEVICES WITH ENHANCED MAXIMUM TEMPERATURE DIFFERENCES BASED ON SPATIALLY VARYING DISTRIBUTED TRANSPORT PROPERTIES
    1.
    发明申请
    THERMOELECTRIC ELEMENTS AND DEVICES WITH ENHANCED MAXIMUM TEMPERATURE DIFFERENCES BASED ON SPATIALLY VARYING DISTRIBUTED TRANSPORT PROPERTIES 有权

    公开(公告)号：US20230120260A1

    公开(公告)日：2023-04-20

    申请号：US18077987

    申请日：2022-12-08

    申请人： DTP Thermoelectrics LLC

    发明人： Lon Bell ,  Douglas Crane

    IPC分类号： H01L35/32 ,  H01L35/26

    摘要： Provided herein is a thermoelectric element that includes a cold end, a hot end, and a p-type or n-type material having a length between the hot end and the cold end. The p-type or n-type material has an intrinsic Seebeck coefficient (S), an electrical resistivity (ρ), and a thermal conductivity (λ). Each of two or more of S, ρ, and λ generally increases along the length from the cold end to the hot end. The thermoelectric element may be provided in single-stage thermoelectric devices providing enhanced maximum temperature differences. The single-stage thermoelectric devices maybe combined with one another to provide multi-stage thermoelectric devices with even further enhanced maximum temperature differences.

    Structure and method for cooling three-dimensional integrated circuits
    2.
    发明授权
    Structure and method for cooling three-dimensional integrated circuits 有权

    公开(公告)号：US11532613B2

    公开(公告)日：2022-12-20

    申请号：US17163960

    申请日：2021-02-01

    申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

    发明人： Hui-Yu Lee ,  Chi-Wen Chang ,  Jui-Feng Kuan ,  Yi-Kan Cheng

    IPC分类号： H01L23/34 ,  H01L23/38 ,  H01L27/06 ,  H01L23/00 ,  H01L25/065 ,  H01L35/26 ,  H01L35/18 ,  H01L23/48

    摘要： A structure and method for cooling a three-dimensional integrated circuit (3DIC) are provided. A cooling element is configured for thermal connection to the 3DIC. The cooling element includes a plurality of individually controllable cooling modules disposed at a first plurality of locations relative to the 3DIC. Each of the cooling modules includes a cold pole and a heat sink. The cold pole is configured to absorb heat from the 3DIC. The heat sink is configured to dissipate the heat absorbed by the cold pole and is coupled to the cold pole via an N-type semiconductor element and via a P-type semiconductor element. A temperature sensing element includes a plurality of thermal monitoring elements disposed at a second plurality of locations relative to the 3DIC for measuring temperatures at the second plurality of locations. The measured temperatures control the plurality of cooling modules.

    Thermoelectric leg and thermoelectric element comprising same
    4.
    发明授权
    Thermoelectric leg and thermoelectric element comprising same 有权

    公开(公告)号：US11342490B2

    公开(公告)日：2022-05-24

    申请号：US16998412

    申请日：2020-08-20

    申请人： LG INNOTEK CO., LTD.

    发明人： Tsuyoshi Tosho

    IPC分类号： H01L35/16 ,  H01L35/32 ,  H01L35/34 ,  H01L35/18 ,  H01L35/26 ,  H01L35/12 ,  H01L35/02 ,  H01L35/10

    摘要： A method may be provided of manufacturing a thermoelectric leg. The method may include preparing a first metal substrate including a first metal, and forming a first plated layer including a second metal on the first metal substrate. The method may also include disposing a layer including tellurium (Te) on the first plated layer, and forming a portion of the first plated layer as a first bonding layer by reacting the second metal and the Te. The method also includes disposing a thermoelectric material layer including bismuth (Bi) and Te on an upper surface of the first bonding layer, and disposing a second metal substrate, on which a second bonding layer and a second plated layer are formed, on the thermoelectric material layer, and sintering.

    Structure and Method for Cooling Three-Dimensional Integrated Circuits
    7.
    发明申请
    Structure and Method for Cooling Three-Dimensional Integrated Circuits 有权

    公开(公告)号：US20210159225A1

    公开(公告)日：2021-05-27

    申请号：US17163960

    申请日：2021-02-01

    申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

    发明人： Hui-Yu Lee ,  Chi-Wen Chang ,  Jui-Feng Kuan ,  Yi-Kan Cheng

    IPC分类号： H01L27/06 ,  H01L23/34 ,  H01L23/00 ,  H01L23/38 ,  H01L25/065 ,  H01L35/26 ,  H01L35/18

    摘要： A structure and method for cooling a three-dimensional integrated circuit (3DIC) are provided. A cooling element is configured for thermal connection to the 3DIC. The cooling element includes a plurality of individually controllable cooling modules disposed at a first plurality of locations relative to the 3DIC. Each of the cooling modules includes a cold pole and a heat sink. The cold pole is configured to absorb heat from the 3DIC. The heat sink is configured to dissipate the heat absorbed by the cold pole and is coupled to the cold pole via an N-type semiconductor element and via a P-type semiconductor element. A temperature sensing element includes a plurality of thermal monitoring elements disposed at a second plurality of locations relative to the 3DIC for measuring temperatures at the second plurality of locations. The measured temperatures control the plurality of cooling modules.