发明授权
US07738588B2 Arrangement comprising a first semiconductor chip and a second semiconductor chip connected thereto 有权
包括第一半导体芯片和与其连接的第二半导体芯片的布置

Arrangement comprising a first semiconductor chip and a second semiconductor chip connected thereto
摘要:
An arrangement including a first semiconductor chip and a second semiconductor chip connected thereto, where the second semiconductor chip is additionally connected to electrical loads and drives these electrical loads on the basis of a timing which is prescribed to it by load control data, and where the first semiconductor chip transmits to the second semiconductor chip the aforementioned load control data and pilot data which control the second semiconductor chip, and where the second semiconductor chip transmits to the first semiconductor chip diagnostic data which represent states prevailing in the second semiconductor chip or events which occur. The first semiconductor chip transmits appropriate pilot data in order to prescribe to the second semiconductor chip what transmission rate is to be used by the second semiconductor chip to transmit the diagnostic data to the first semiconductor chip.
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