发明授权
- 专利标题: Mixed-scale electronic interfaces
- 专利标题(中): 混合电子接口
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申请号: US11590492申请日: 2006-10-30
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公开(公告)号: US07741204B2公开(公告)日: 2010-06-22
- 发明人: Zhiyong Li , Warren Robinett
- 申请人: Zhiyong Li , Warren Robinett
- 申请人地址: US TX Houston
- 专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人地址: US TX Houston
- 主分类号: H01L21/44
- IPC分类号: H01L21/44
摘要:
Certain embodiments of the present invention are directed to a method of fabricating a mixed-scale electronic interface. A substrate is provided with a first set of conductive elements. A first layer of nanowires may be formed over the first set of conductive elements. A number of channels may be formed, with each of the channels extending diagonally through a number of the nanowires of the first layer. A number of pads may be formed, each of which is electrically interconnected with an underlying conductive element of the first set of conductive elements and one or more adjacent nanowires of the first layer of nanowires. The pads and corresponding electrically interconnected nanowires define a number of pad-interconnected-nanowire-units. Additional embodiments are directed to a method of forming a nanoimprinting mold and a method of selectively programming nanowire-to-conductive element electrical connections.
公开/授权文献
- US20080099929A1 Mixed-scale electronic interfaces 公开/授权日:2008-05-01
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