发明授权
US07749844B2 Method for fabricating semiconductor device having vertical-type channel
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制造具有垂直型通道的半导体器件的方法
- 专利标题: Method for fabricating semiconductor device having vertical-type channel
- 专利标题(中): 制造具有垂直型通道的半导体器件的方法
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申请号: US11479439申请日: 2006-06-29
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公开(公告)号: US07749844B2公开(公告)日: 2010-07-06
- 发明人: Jung Woo Park
- 申请人: Jung Woo Park
- 申请人地址: KR Icheon-si
- 专利权人: Hynix Semiconductor Inc.
- 当前专利权人: Hynix Semiconductor Inc.
- 当前专利权人地址: KR Icheon-si
- 代理机构: Townsend and Townsend and Crew LLP
- 优先权: KR10-2005-0132568 20051228
- 主分类号: H01L21/336
- IPC分类号: H01L21/336
摘要:
A semiconductor device includes an active region including a surface region and a first recess formed below the surface region, the active region extending along a first direction; a device isolation structure provided on an edge of the active region; a gate line traversing over the surface region of the active region along a second direction orthogonal to the first direction; a second recess formed in the device isolation structure to receive a given portion of the gate line into the second recess; a first junction region formed in the active region beneath the first recess and on a first side of the gate line; and a second junction region formed on a second side of the gate line and above the first junction region, wherein the first and second junction regions define a vertical-type channel that extends along lateral and vertical directions.
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