发明授权
- 专利标题: Semiconductor apparatus and method for manufacturing the semiconductor apparatus
- 专利标题(中): 半导体装置及半导体装置的制造方法
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申请号: US11858361申请日: 2007-09-20
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公开(公告)号: US07750383B2公开(公告)日: 2010-07-06
- 发明人: Hiroyuki Kanaya
- 申请人: Hiroyuki Kanaya
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JPP2006-256262 20060921
- 主分类号: H01L27/108
- IPC分类号: H01L27/108
摘要:
According to an aspect of the present invention, there is provided a semiconductor apparatus including a semiconductor substrate, a transistor formed on the semiconductor substrate, an insulating film disposed on the semiconductor substrate, a ferroelectric capacitor and an upper mask. The ferroelectric capacitor includes a lower electrode disposed on the insulating film, a ferroelectric film disposed on the lower electrode and an upper electrode disposed on the ferroelectric film. The upper mask includes a hard mask disposed on the upper electrode and a sidewall mask disposed on at least part of a sidewall of the hard mask.
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