发明授权
- 专利标题： Design structure incorporating a hybrid substrate
- 专利标题（中）： 结合混合基板的设计结构
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申请号： US11877871申请日： 2007-10-24
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公开(公告)号： US07750406B2公开(公告)日： 2010-07-06
- 发明人: Ethan Harrison Cannon , Toshiharu Furukawa , John Gerard Gaudiello , Mark Charles Hakey , Steven John Holmes , David Vaclav Horak , Charles William Koburger, III , Jack Allan Mandelman , William Robert Tonti
- 申请人： Ethan Harrison Cannon , Toshiharu Furukawa , John Gerard Gaudiello , Mark Charles Hakey , Steven John Holmes , David Vaclav Horak , Charles William Koburger, III , Jack Allan Mandelman , William Robert Tonti
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Wood, Herron & Evans, LLP
- 主分类号： H01L23/62
- IPC分类号： H01L23/62 ; H01L29/94
摘要：
Design structure embodied in a machine readable medium for designing, manufacturing, or testing a design in which the design structure includes devices formed in a hybrid substrate characterized by semiconductor islands of different crystal orientations. An insulating layer divides the islands of at least one of the different crystal orientations into mutually aligned device and body regions. The body regions may be electrically floating relative to the device regions.
公开/授权文献
- US20080258222A1 Design Structure Incorporating a Hybrid Substrate 公开/授权日：2008-10-23
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