发明授权
- 专利标题: Method of pretreatment of material to be electrolessly plated
- 专利标题(中): 无电镀材料预处理方法
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申请号: US10474720申请日: 2002-04-08
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公开(公告)号: US07754062B2公开(公告)日: 2010-07-13
- 发明人: Masatsugu Nakanishi , Takeshi Bessho
- 申请人: Masatsugu Nakanishi , Takeshi Bessho
- 申请人地址: JP Toyota-shi
- 专利权人: Toyota Jidosha Kabushiki Kaisha
- 当前专利权人: Toyota Jidosha Kabushiki Kaisha
- 当前专利权人地址: JP Toyota-shi
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2001-114281 20010412
- 国际申请: PCT/JP02/03513 WO 20020408
- 国际公布: WO02/088422 WO 20021107
- 主分类号: C25D5/56
- IPC分类号: C25D5/56 ; C23C18/20 ; C23C18/28 ; C23C18/30 ; B05D3/10
摘要:
After treated in a solution containing ozone, a plating material is brought into contact with a solution containing at least one of an anionic surface active agent and a nonionic surface active agent, and an alkaline component. Ozone acts to locally break unsaturated bonds on a surface of the plating material to form C—OH bonds or C═O bonds, thereby activating the surface of the plating material, and since a surface active agent 1 is adsorbed thereon, a catalyst 2 is adsorbed on hydrophilic groups of the surface active agent 1 which has been adsorbed on the above-described functional groups. Consequently, no etching treatment is required, and an electroless plated coating having excellent adhesion can be formed without roughening the surface of the resin material.
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