公开(公告)号：US11865518B2

公开(公告)日：2024-01-09

申请号：US17075130

申请日：2020-10-20

申请人： National Tsing Hua University

发明人： Tzu-Chien Wei ,  Yu-Hsiang Kao

IPC分类号： C23C18/18 ,  B01J23/44 ,  B01J31/02 ,  B01J35/00 ,  B01J31/06 ,  B01J37/02 ,  B01J37/03 ,  C23C18/20 ,  C23C18/30 ,  B01J37/04 ,  B01J37/08 ,  C23C18/34

CPC分类号： B01J23/44 ,  B01J31/0238 ,  B01J31/0254 ,  B01J31/0274 ,  B01J31/0275 ,  B01J31/06 ,  B01J35/006 ,  B01J35/0013 ,  B01J37/0209 ,  B01J37/031 ,  C23C18/1831 ,  C23C18/1879 ,  C23C18/206 ,  C23C18/30 ,  B01J31/0204 ,  B01J37/04 ,  B01J37/08 ,  C23C18/34

摘要： The instant disclosure provides a method for manufacturing an electroless plating substrate and a method for forming a metal layer on a surface of a substrate. The method for preparing the electroless plating substrate includes: providing a substrate; attaching a self-adsorbed catalyst composition to a surface of the substrate; and performing an electroless metal deposition for forming an electroless metal layer on the surface of the substrate. The self-adsorbed catalyst composition includes a colloidal nanoparticle and a silane compound. The colloidal nanoparticle includes a palladium nanoparticle and a capping agent enclosing the palladium nanoparticle. The silane compound has at least one amino group to interact with the colloidal nanoparticle. A covalent bond between the silane compound and the surface of the substrate is formed through the at least one silane group of the silane compound. The colloid nanoparticle has a particle size ranging from 5 to 10 nanometers.

公开(公告)号：US11851754B2

公开(公告)日：2023-12-26

申请号：US15801497

申请日：2017-11-02

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Peng-Cheng Hong ,  Jun-Liang Pu ,  W. L. Hsu ,  Chung-Hao Kao ,  Chia-Chun Hung ,  Cheng-Yi Wu ,  Chin-Szu Lee

IPC分类号： C23C16/44 ,  C23C14/02 ,  C23C18/18 ,  B29D99/00 ,  C23C14/34 ,  C25D7/04 ,  H01J37/32 ,  C23C14/20 ,  B29K19/00 ,  C25D5/56 ,  C23C18/28 ,  C23C18/24 ,  C23C8/30 ,  C23C18/20 ,  C23C18/30

CPC分类号： C23C16/4409 ,  B29D99/0053 ,  C23C14/021 ,  C23C14/205 ,  C23C14/34 ,  C23C18/1875 ,  C25D7/04 ,  H01J37/32513 ,  B29K2019/00 ,  C23C18/2086 ,  C23C18/24 ,  C23C18/285 ,  C23C18/30 ,  C25D5/56

摘要： A sealing article includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.

公开(公告)号：US20230313383A1

公开(公告)日：2023-10-05

申请号：US18024550

申请日：2021-08-23

申请人： PAC TECH - PACKAGING TECHNOLOGIES GMBH

发明人： Vinith Bejugam ,  Thorsten Teutsch

IPC分类号： C23C18/18 ,  C23C18/30 ,  C23C18/20 ,  C23C18/40

CPC分类号： C23C18/1893 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/40

摘要： A method for electrolessly depositing a metal layer onto a substrate, including the following chronological steps:

a) treating the substrate surface to be plated with an etching solution;
b) treating the substrate surface to be plated with a polyelectrolyte or an organosilane compound;
c) treating the surface to be plated with a solution containing metal particles;
d) treating the surface to be plated with a solution containing at least one salt of the metal to be deposited onto the substrate.

公开(公告)号：US11660029B2

公开(公告)日：2023-05-30

申请号：US16302664

申请日：2017-05-12

申请人： VivaChek Biotech (Hangzhou) Co., Ltd ,  Zhejiang University City College

发明人： Yuquan Chen ,  Wei Chen

IPC分类号： A61B5/1473 ,  C23C18/16 ,  C23C18/30 ,  C23C18/20 ,  C23C18/44 ,  A61B5/145 ,  A61B5/1486 ,  C23C28/02 ,  C25D3/50 ,  A61B5/1495 ,  A61B5/00 ,  B05D5/12

CPC分类号： A61B5/1473 ,  A61B5/1486 ,  A61B5/14532 ,  A61B5/14865 ,  C23C18/1641 ,  C23C18/1653 ,  C23C18/30 ,  C23C28/023 ,  C25D3/50 ,  A61B5/1495 ,  A61B5/6847 ,  B05D5/12 ,  C23C18/2086 ,  C23C18/44

摘要： Provided in the present invention are a flexible electrochemical electrode, a subcutaneous continuous glucose monitoring sensor equipped with the electrochemical electrode, and a preparation method thereof. The electrode directly uses gold layers on both sides of a chemically plated film, respectively as a working electrode and a reference-counter electrode, so as to form an electrochemical two-electrode system. Petaloid platinum nanoparticles are electrodeposited on a surface of the configured working electrode as a catalytic layer; a carbon nanotube/Nafion mesh layer functions as an anti-interference layer, and is formed thereon with an enzyme biochemical sensitive layer by means of electrostatic adsorption, after crosslinking and curing in glutaraldehyde, polyurethane mass transfer is coated to limit a protection layer, so as to prepare a flexible continuous glucose monitoring sensor. The sensor does not require photolithography, screen printing or other technologies to construct an electrochemical electrode system. The present invention effectively simplifies the processing technology, can easily achieve large-scale production and reduce production costs; and meanwhile, the present invention has characteristics such as a wide linear range, low detection limit, powerful anti-interference capacity, high response sensitivity and long-term stability.

公开(公告)号：US11649558B2

公开(公告)日：2023-05-16

申请号：US15507382

申请日：2016-01-29

申请人： OKUNO CHEMICAL INDUSTRIES CO., LTD.

发明人： Yusuke Yoshikane ,  Koji Kita

IPC分类号： C25F5/00 ,  C01B7/09 ,  C01B21/38 ,  C01C1/00 ,  C01G55/00 ,  C25D5/56 ,  C25D17/06 ,  C23C18/16 ,  C23C18/30

CPC分类号： C25F5/00 ,  C01B7/096 ,  C01B21/38 ,  C01C1/00 ,  C01G55/001 ,  C23C18/163 ,  C23C18/30 ,  C25D5/56 ,  C25D17/06 ,  C23C18/1653

摘要： An object of the invention is to provide a jig electrolytic stripper that can sufficiently remove palladium adhered to the current-conducting portion of a plating jig, that can remove palladium adhered to the insulating-material-coated portion of the jig, and that exhibits reduced erosion of the metal of the current-conducting portion of the jig. The jig electrolytic stripper comprises the following components (A) to (C): (A) at least one member selected from the group consisting of nitric acid and salts thereof, (B) at least one member selected from the group consisting of ammonia, ammonium salts, ethylene amine compounds, alkyl diamine compounds, and amino acids, and (C) a bromide.

公开(公告)号：US11490528B2

公开(公告)日：2022-11-01

申请号：US17017984

申请日：2020-09-11

申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA

发明人： Kazuaki Okamoto ,  Hiroshi Yanagimoto ,  Rentaro Mori

IPC分类号： H05K1/02 ,  H05K1/09 ,  H05K3/02 ,  H05K3/16 ,  H05K3/24 ,  H05K3/46 ,  C23C18/16 ,  C23C18/30 ,  C23C18/31 ,  C23C18/38 ,  C23C18/54 ,  C25D17/00 ,  C25D17/02 ,  H01M6/00 ,  H01M10/04 ,  H01M10/36 ,  H05K3/38 ,  H05K3/20

摘要： Provided is a method for manufacturing a wiring board that forms a wiring layer having favorable adhesion without a resin resist pattern. A method prepares a substrate with seed-layer including: a underlayer on the surface of an insulating substrate; and a seed layer on the surface of the underlayer, the seed layer having a predetermined pattern and containing metal; presses a solid electrolyte membrane against the seed layer and the underlayer, and applies voltage between an anode and the underlayer to reduce metal ions in the membrane and form a metal layer on the surface of the seed layer; and removes an exposed region without the seed layer and the metal layer of the underlayer to form a wiring layer including the underlayer, the seed layer and the metal layer on the surface of the substrate.

公开(公告)号：US20220235467A1

公开(公告)日：2022-07-28

申请号：US17610604

申请日：2020-05-15

申请人： FUNDACIÓN CIDETEC

发明人： Asier SALICIO PAZ ,  Eva GARCÍA LECINA ,  Egoitz LUIS MONASTERIO

IPC分类号： C23C18/36 ,  C23C18/16 ,  C23C18/30 ,  C23C18/28 ,  C23C18/40 ,  C23C18/44

摘要： It is provided a method for manufacturing a metal coated substrate by forming a metal coating on a surface of a substrate, comprising: immersing the substrate in a palladium/tin colloidal solution; immersing the substrate in an acid solution; carrying out electroless metal plating in order to obtain a continuous film-coated substrate, and subjecting the metal coating to a cryogenic treatment step in order to make it permeable to electromagnetic waves, the cryogenic treatment step being carried out by cooling the substrate with liquid nitrogen. It is also provided a metal coated substrate obtainable by the mentioned method and an article of manufacture made of the metal coated substrate.

公开(公告)号：US11309503B2

公开(公告)日：2022-04-19

申请号：US16374805

申请日：2019-04-04

申请人： NIKON CORPORATION

发明人： Shohei Koizumi ,  Takashi Sugizaki ,  Yusuke Kawakami

IPC分类号： H01L51/00 ,  H01L51/05 ,  H01L21/02 ,  H01L21/28 ,  H01L21/288 ,  H01L29/786 ,  C23C18/31 ,  C23C18/32 ,  C23C28/00 ,  C23C18/16 ,  H01L29/45 ,  H01L29/49 ,  H01L27/12 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40 ,  C23C18/30 ,  C23C18/34 ,  C23C18/42

摘要： A transistor manufacturing method includes forming a source electrode and a drain electrode on a substrate, forming a layer including an insulator layer to cover the source electrode and the drain electrode, and forming a gate electrode on the layer including the insulator layer, wherein the forming the gate electrode includes forming a plating base film, forming a protection layer of the plating base film, forming a photoresist layer on the protection layer to expose the photoresist layer with desired patterning light, causing the exposed photoresist layer to come into contact with a developer to remove the photoresist layer and the protection layer until the plating base film is uncovered corresponding to the patterning light, and after depositing a metal on the uncovered plating base film, causing an electroless plating solution to come into contact with the plating base film to perform electroless plating.

公开(公告)号：US11136671B2

公开(公告)日：2021-10-05

申请号：US15778988

申请日：2016-11-25

申请人： SOLVAY SPECIALTY POLYMERS ITALY S.P.A.

发明人： Paula Cojocaru ,  Andrea Vittorio Oriani ,  Stefano Mauri ,  Marco Apostolo

IPC分类号： C23C18/20 ,  C23C18/22 ,  C23C18/30 ,  H04R31/00 ,  H04R7/12 ,  C23C18/40 ,  C08G65/40 ,  C08L81/06 ,  C23C18/44 ,  C23C18/16

摘要： The present invention relates to a composition in the form of sheet or layer comprising a layer of an aromatic polymer and a layer of metal adhering to at least one side of said polymeric sheet, and to its uses.

公开(公告)号：US11028484B2

公开(公告)日：2021-06-08

申请号：US16345684

申请日：2017-10-30

申请人： Agency for Science, Technology and Research

发明人： Shengqin Wang ,  Yew Wei Leong

IPC分类号： C23C18/32 ,  C08K3/013 ,  C08K5/05 ,  C08K5/17 ,  C08L83/04 ,  C23C18/12 ,  C23C18/16 ,  C23C18/18 ,  C23C18/20 ,  C23C18/28 ,  C23C18/30 ,  H01B1/22 ,  C08K3/22

摘要： According to the present disclosure, a method for coating nickel on an organosiloxane polymer wherein the said method comprises the steps of; forming a transition metal oxide on the organosiloxane polymer; etching the transition metal oxide with a basic solution; contacting the organosiloxane polymer comprising the etched transition metal oxide with an aqueous solution comprising a positively charged species to attach the positively charged species on the etched transition metal oxide; depositing a metal catalyst on the positively charged species; and treating the metal catalyst with an acidic solution to develop an activated organosiloxane polymer before transferring the activated organosiloxane polymer to a solution comprising nickel and/or nickel derivatives. A nickel organosiloxane composite is provided herein comprising a transition metal oxide layer and a positively charged species attached on the said oxide layer with nickel coated in the said positively charged species.