发明授权
US07754576B2 Method of forming inside rough and outside smooth HSG electrodes and capacitor structure
失效
粗糙和外部平滑HSG电极和电容器结构内部形成方法
- 专利标题: Method of forming inside rough and outside smooth HSG electrodes and capacitor structure
- 专利标题(中): 粗糙和外部平滑HSG电极和电容器结构内部形成方法
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申请号: US12326458申请日: 2008-12-02
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公开(公告)号: US07754576B2公开(公告)日: 2010-07-13
- 发明人: Lingyi A. Zheng
- 申请人: Lingyi A. Zheng
- 申请人地址: US ID Boise
- 专利权人: Micron Technology, Inc.
- 当前专利权人: Micron Technology, Inc.
- 当前专利权人地址: US ID Boise
- 代理机构: Whyte Hirschboeck Dudek SC
- 主分类号: H01L21/8242
- IPC分类号: H01L21/8242 ; H01L21/20
摘要:
A container capacitor and method of forming the container capacitor are provided. The container capacitor comprises a lower electrode fabricated by forming a layer of doped polysilicon within a container in an insulative layer disposed on a substrate; forming a barrier layer over the polysilicon layer within the container; removing the insulative layer to expose the polysilicon layer outside the container; nitridizing the exposed polysilicon layer at a low temperature, preferably by remote plasma nitridation; removing the barrier layer to expose the inner surface of the polysilicon layer within the container; and forming HSG polysilicon over the inner surface of the polysilicon layer. The capacitor can be completed by forming a dielectric layer over the lower electrode, and an upper electrode over the dielectric layer. The cup-shaped bottom electrode formed within the container defines an interior surface comprising HSG polysilicon, and an exterior surface comprising smooth polysilicon.
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