发明授权
- 专利标题： Resist pattern processing equipment and resist pattern processing method
- 专利标题（中）： 抗蚀图案处理设备和抗蚀图案处理方法
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申请号： US11714737申请日： 2007-03-07
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公开(公告)号： US07755064B2公开(公告)日： 2010-07-13
- 发明人: Hitoshi Hatate , Akifumi Kamijima
- 申请人： Hitoshi Hatate , Akifumi Kamijima
- 申请人地址： JP Tokyo
- 专利权人： TDK Corporation
- 当前专利权人： TDK Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Oliff & Berridge, PLC
- 主分类号： B08B7/00
- IPC分类号： B08B7/00 ; H01L21/302
摘要：
A resist pattern processing apparatus comprises a stage for mounting a substrate having a patterned photoresist arranged on a surface thereof, a UV-emitting part for emitting UV rays to the stage, and an annular member for surrounding the whole periphery of the substrate. This allows the annular member to restrain ozone supplied near a mounting surface for the substrate on the stage from diffusing to the periphery of the stage, whereby the ozone concentration becomes even in the surface of the substrate mounted on the stage.
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