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发明授权
US07755180B2 Integrated circuit package-in-package system 有权
集成电路封装封装系统

Integrated circuit package-in-package system
摘要：
An integrated circuit package-in-package system is provided forming a first integrated circuit package having a first interface, stacking a second integrated circuit package having a second interface above the first integrated circuit package, fitting the first interface and the second interface, and attaching a third integrated circuit package on the second integrated circuit package.
摘要（中）：

提供一种集成电路封装包装系统，其形成具有第一接口的第一集成电路封装，堆叠具有在第一集成电路封装之上的第二接口的第二集成电路封装，装配第一接口和第二接口，并附接 第二集成电路封装上的第三集成电路封装。

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