Invention Grant
- Patent Title: Chip resistor and manufacturing method therefor
- Patent Title (中): 芯片电阻及其制造方法
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Application No.: US12002751Application Date: 2007-12-18
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Publication No.: US07755468B2Publication Date: 2010-07-13
- Inventor: Torayuki Tsukada
- Applicant: Torayuki Tsukada
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Main IPC: H01C10/00
- IPC: H01C10/00
Abstract:
A chip resistor includes a resistive element (1), an insulation layer (4) formed in a back surface of the flat surface, and two electrodes (3) spaced from each other via the insulation layer. Each electrode (3) makes contact with the insulation layer (4). Each electrode (3) has a lower surface formed with a solder layer (39).
Public/Granted literature
- US20080272879A1 Chip resistor and manufacturing method therefor Public/Granted day:2008-11-06
Information query
