发明授权
- 专利标题: Multilayer wiring board
- 专利标题(中): 多层接线板
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申请号: US11212684申请日: 2005-08-29
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公开(公告)号: US07757394B2公开(公告)日: 2010-07-20
- 发明人: Yoshio Watanabe
- 申请人: Yoshio Watanabe
- 申请人地址: JP Tokyo
- 专利权人: Sony Corporation
- 当前专利权人: Sony Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Finnegan, Henderson, Farabow, Garrett and Dunner, L.L.P.
- 优先权: JPP2004-253593 20040831
- 主分类号: H01K3/10
- IPC分类号: H01K3/10
摘要:
A multilayer wiring board having a plurality of wiring layers is proposed, which is prepared by a process having the steps of: forming, on one insulating sheet, wiring patterns for all the wiring layers, which patterns are arranged at predetermined positions; and folding the insulating sheet having formed the wiring patterns in the predetermined order and stacking the folded sheet while positioning, and then heating the resultant sheet in a vacuum under a pressure to form a three-dimensional electric wiring.