发明授权
- 专利标题： Post last wiring level inductor using patterned plate process
- 专利标题（中）： 使用图案板工艺后最后布线级电感器
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申请号： US12170489申请日： 2008-07-10
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公开(公告)号： US07763954B2公开(公告)日： 2010-07-27
- 发明人: Anil Kumar Chinthakindi , Douglas Duane Coolbaugh , John Edward Florkey , Jeffrey Peter Gambino , Zhong-Xiang He , Anthony Kendall Stamper , Kunal Vaed
- 申请人： Anil Kumar Chinthakindi , Douglas Duane Coolbaugh , John Edward Florkey , Jeffrey Peter Gambino , Zhong-Xiang He , Anthony Kendall Stamper , Kunal Vaed
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Schmeiser, Olsen & Watts
- 代理商 Anthony J. Canale
- 主分类号： H01L29/00
- IPC分类号： H01L29/00
摘要：
A semiconductor structure. The semiconductor structure includes: a substrate having at least one metal wiring level within the substrate; an insulative layer on a surface of the substrate; an inductor within the insulative layer; and a wire bond pad within the insulative layer. The inductor and the wire bond pad are substantially co-planar. The inductor has a height greater than a height of the wire bond pad.