Invention Grant
- Patent Title: Seal device and sealing structure
- Patent Title (中): 密封装置和密封结构
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Application No.: US11645282Application Date: 2006-12-22
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Publication No.: US07765821B2Publication Date: 2010-08-03
- Inventor: Yoshinori Araki , Takuya Natsume
- Applicant: Yoshinori Araki , Takuya Natsume
- Applicant Address: JP Kariya
- Assignee: Denso Corporation
- Current Assignee: Denso Corporation
- Current Assignee Address: JP Kariya
- Agency: Harness, Dickey & Pierce, PLC
- Priority: JP2005-375669 20051227; JP2006-265520 20060928
- Main IPC: F25B41/04
- IPC: F25B41/04 ; F16J15/02

Abstract:
A seal device has a for sealing a through hole in a partition includes a first seal for providing a first abutment portion that abuts against a periphery of the through hole in an entirety thereof, and a second seal for providing a second abutment portion that is made of an elastic material for abutting against an outer peripheral surface of a component disposed in the through hole. The first seal and the second seal are connected to cover an entire periphery of the through and the component, and a support member on the second seal has an inner surface shaped in a corresponding form of the component.
Public/Granted literature
- US20070144208A1 Seal device and sealing structure Public/Granted day:2007-06-28
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