Invention Grant
US07765865B2 Flow sensor unit including an insulating member interposed between the sensor chip and the attachment plate
有权
流量传感器单元包括介于传感器芯片和安装板之间的绝缘构件
- Patent Title: Flow sensor unit including an insulating member interposed between the sensor chip and the attachment plate
- Patent Title (中): 流量传感器单元包括介于传感器芯片和安装板之间的绝缘构件
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Application No.: US12191924Application Date: 2008-08-14
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Publication No.: US07765865B2Publication Date: 2010-08-03
- Inventor: Shinichi Ike , Shoji Kamiunten , Junji Kumasa
- Applicant: Shinichi Ike , Shoji Kamiunten , Junji Kumasa
- Applicant Address: JP
- Assignee: Yamatake Corporation
- Current Assignee: Yamatake Corporation
- Current Assignee Address: JP
- Agency: Cantor Colburn LLP
- Priority: JP2007-244543 20070920
- Main IPC: G01F1/68
- IPC: G01F1/68
Abstract:
A flow sensor may be formed of a sensor chip in which a flow rate detecting section is formed on an electric insulating film applied to cover at least a part of a concave portion formed on an upper surface of a substrate and may also include a flow path forming member which is provided on the sensor chip and has a flow path of a fluid flowing through the flow rate detecting section formed therein.
Public/Granted literature
- US20090078041A1 FLOW SENSOR UNIT Public/Granted day:2009-03-26
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