Invention Grant
- Patent Title: Abutment module
- Patent Title (中): 基台模块
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Application No.: US11488797Application Date: 2006-07-19
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Publication No.: US07766156B2Publication Date: 2010-08-03
- Inventor: Helmut Worner , Sebastian Unterhuber
- Applicant: Helmut Worner , Sebastian Unterhuber
- Agency: Browdy and Neimark, PLLC
- Priority: EP05015616 20050719; EP05022965 20051021
- Main IPC: B65G47/00
- IPC: B65G47/00 ; B65G47/26 ; B65G15/64 ; B65G21/22 ; B65G13/00
Abstract:
A abutment module for automatic processing and conveying equipment having an abutment member arranged on a base for objects moving in a movement plane in a current direction of working motion. The abutment member being able to be moved in and out of the movement plane by electrical actuating apparatus. An electrical rotary drive is provided for the electrical operation.
Public/Granted literature
- US20070017909A1 Abutment module Public/Granted day:2007-01-25
Information query
IPC分类:
