Invention Grant
- Patent Title: Plasma boriding method
- Patent Title (中): 等离子体硼化法
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Application No.: US11534086Application Date: 2006-09-21
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Publication No.: US07767274B2Publication Date: 2010-08-03
- Inventor: Habib Skaff
- Applicant: Habib Skaff
- Applicant Address: US FL Tampa
- Assignee: Skaff Corporation of America
- Current Assignee: Skaff Corporation of America
- Current Assignee Address: US FL Tampa
- Agency: Choate Hall & Stewart LLP
- Agent Andrea L. C. Robidoux
- Main IPC: H05H1/24
- IPC: H05H1/24
Abstract:
The present invention relates to a method of preparing wear-resistant metallic surfaces.
Public/Granted literature
- US20070098917A1 Plasma Boriding Method Public/Granted day:2007-05-03
Information query
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