Invention Grant
- Patent Title: Cover for a hybridization chamber
- Patent Title (中): 盖杂交室
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Application No.: US10931521Application Date: 2004-09-01
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Publication No.: US07767440B2Publication Date: 2010-08-03
- Inventor: Martin Seippel , Sandrine Hamels , Christopher VanHuffel
- Applicant: Martin Seippel , Sandrine Hamels , Christopher VanHuffel
- Applicant Address: DE Hamburg
- Assignee: Eppendorf AG
- Current Assignee: Eppendorf AG
- Current Assignee Address: DE Hamburg
- Agency: Vidas, Arrett & Steinkraus PA
- Priority: DE10340473 20030903
- Main IPC: C12M1/34
- IPC: C12M1/34

Abstract:
Cover of a hybridization chamber with a peripheral frame with filling and ventilation holes extending from the upper face to the lower face of the frame, a peripheral shoulder outside the filling and ventilation holes on the lower face of the frame, a cover wall arranged within the frame, flush with its lower face and downwardly offset relative to its upper face and which substantially consists of at least one resilient plastics material.
Public/Granted literature
- US20050118708A1 Cover for a hybridization chamber Public/Granted day:2005-06-02
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