Invention Grant
US07767508B2 Method for forming offset spacers for semiconductor device arrangements
有权
用于形成用于半导体器件布置的偏置间隔物的方法
- Patent Title: Method for forming offset spacers for semiconductor device arrangements
- Patent Title (中): 用于形成用于半导体器件布置的偏置间隔物的方法
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Application No.: US11580952Application Date: 2006-10-16
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Publication No.: US07767508B2Publication Date: 2010-08-03
- Inventor: Philip A. Fisher , Laura A. Brown , Johannes Groschopf , Huicai Zhong
- Applicant: Philip A. Fisher , Laura A. Brown , Johannes Groschopf , Huicai Zhong
- Applicant Address: US CA Sunnyvale
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Volpe and Koenig, P.C.
- Main IPC: H01L21/338
- IPC: H01L21/338

Abstract:
Methods are provided for the fabrication of abrupt and tunable offset spacers for improved transistor short channel control. The methods include the formation of a gate electrode within a dielectric layer, with only a top portion of the gate electrode exposed. Silicon is added on the top portion of the gate electrode, by selective epitaxial growth, for example. Etching of the dielectric layer is performed with added silicon at the top portion of the gate electrode serving as a silicon mask to prevent etching of the dielectric layer directly underneath the silicon mask, which includes overhangs over the gate electrode sidewalls. The etching creates offset spacers in a production-worthy manner, and can be used to form offset spacers that are asymmetrical in width. By running the methodology in a microloading regime, wider offset spacers may be created on narrower polysilicon gate features, thereby improving Vt roll-off.
Public/Granted literature
- US20080090368A1 Method for forming offset spacers for semiconductor device arrangements Public/Granted day:2008-04-17
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