Invention Grant
- Patent Title: Stabilizing breakdown voltages by forming tunnels for ultra-high voltage devices
- Patent Title (中): 通过形成超高压设备的隧道来稳定击穿电压
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Application No.: US12170285Application Date: 2008-07-09
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Publication No.: US07768071B2Publication Date: 2010-08-03
- Inventor: Eric Huang , Tsung-Yi Huang , Fu-Hsin Chen , Chyi-Chyuan Huang , Puo-Yu Chiang
- Applicant: Eric Huang , Tsung-Yi Huang , Fu-Hsin Chen , Chyi-Chyuan Huang , Puo-Yu Chiang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/62
- IPC: H01L23/62

Abstract:
A semiconductor structure includes a semiconductor substrate of a first conductivity type; a pre-high-voltage well (pre-HVW) in the semiconductor substrate, wherein the pre-HVW is of a second conductivity type opposite the first conductivity type; a high-voltage well (HVW) over the pre-HVW, wherein the HVW is of the second conductivity type; a field ring of the first conductivity type occupying a top portion of the HVW; and a tunnel of the first conductivity type in the pre-HVW and the HVW, and electrically connecting the field ring and the semiconductor substrate.
Public/Granted literature
- US20100006933A1 Stabilizing Breakdown Voltages by Forming Tunnels for Ultra-High Voltage Devices Public/Granted day:2010-01-14
Information query
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