Invention Grant
- Patent Title: Surface-shape sensor and method of manufacturing the same
- Patent Title (中): 表面形状传感器及其制造方法
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Application No.: US11838469Application Date: 2007-08-14
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Publication No.: US07768082B2Publication Date: 2010-08-03
- Inventor: Kouichi Nagai
- Applicant: Kouichi Nagai
- Applicant Address: JP Yokohama
- Assignee: Fujitsu Semiconductor Limited
- Current Assignee: Fujitsu Semiconductor Limited
- Current Assignee Address: JP Yokohama
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2006-222015 20060816
- Main IPC: H01L29/84
- IPC: H01L29/84 ; H01L21/4763
Abstract:
According to the present embodiment, a surface-shape sensor is provided. The surface-shape sensor includes a silicon substrate, an interlayer insulating film formed over the silicon substrate, a first moisture-barrier insulating film formed on the interlayer insulating film, a detection-electrode film formed on the first moisture-barrier insulating film, a second moisture-barrier insulating film formed on the detection-electrode film and a protection insulating film formed on the second moisture-barrier insulating film and provided with a window on the detection electrode film.
Public/Granted literature
- US20080042226A1 SURFACE-SHAPE SENSOR AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2008-02-21
Information query
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