Invention Grant
- Patent Title: Vibration-damping structure for audio apparatus
- Patent Title (中): 音响设备的振动阻尼结构
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Application No.: US11775993Application Date: 2007-07-11
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Publication No.: US07773373B2Publication Date: 2010-08-10
- Inventor: Tsuyoshi Morohashi , Mamoru Sekiya , Norio Etoh , Norimasa Kitagawa
- Applicant: Tsuyoshi Morohashi , Mamoru Sekiya , Norio Etoh , Norimasa Kitagawa
- Applicant Address: JP Neyagawa-shi
- Assignee: Onkyo Corporation
- Current Assignee: Onkyo Corporation
- Current Assignee Address: JP Neyagawa-shi
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: JP2006-347501 20061225
- Main IPC: G06F1/16
- IPC: G06F1/16

Abstract:
The present invention provides a vibration-damping structure for an audio apparatus, accommodating a main transformer, which becomes a vibration source when driven, the vibration-damping structure including: a main chassis to which a signal processing board for processing an audio signal is attached, the first chassis defining a portion of an outer shape of an assembly of the vibration-damping structure; a sub-chassis fastened to an inner surface of the main chassis so as to be partially in contact with the inner surface of the main chassis via a plurality of fastening members; and a component accommodating chassis fastened to an inner surface of the sub-chassis so as to be partially in contact with the inner surface of the sub-chassis via other fastening members, wherein the main transformer is fixed to the component accommodating chassis.
Public/Granted literature
- US20080149805A1 VIBRATION-DAMPING STRUCTURE FOR AUDIO APPARATUS Public/Granted day:2008-06-26
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