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Invention Grant
US07777256B2 Mask ROM device, semiconductor device including the mask ROM device, and methods of fabricating mask ROM device and semiconductor device 有权
掩模ROM器件，包括掩模ROM器件的半导体器件，以及制造掩模ROM器件和半导体器件的方法

Mask ROM device, semiconductor device including the mask ROM device, and methods of fabricating mask ROM device and semiconductor device
Abstract:
A mask read-only memory (ROM) device, which can stably output data, includes an on-cell and an off-cell. The on-cell includes an on-cell gate structure on a substrate and an on-cell junction structure within the substrate. The off-cell includes an off-cell gate structure on the substrate and an off -cell junction structure within the substrate. The on-cell gate structure includes an on-cell gate insulating film, an on-cell gate electrode and an on-cell gate spacer. The on-cell junction structure includes first and second on-cell ion implantation regions of a first polarity and third and fourth on-cell ion implantation regions of a second polarity. The off-cell gate structure includes an off-cell gate insulating film, an off-cell gate electrode and an off-cell gate spacer. The off-cell junction structure includes first and second off-cell ion implantation regions of the first polarity and a third off-cell ion implantation region of the second polarity.
Abstract(Chinese):

可以稳定地输出数据的掩模只读存储器（ROM）装置包括接通电池和截止电池。 开放单元包括衬底上的孔上栅极结构和衬底内的电池单元结结构。 离子电池包括在衬底上的离子栅极结构和衬底内的离子阱结结构。 单体栅极结构包括单元间栅极绝缘膜，单晶体栅极电极和单元间栅极间隔物。 该单电池结结构包括具有第一极性的第一和第二开孔离子注入区和第二极性的第三和第四接通电离子注入区。 离群栅极结构包括离子栅极绝缘膜，离子阱栅极电极和非电池栅极间隔物。 离电池结结构包括具有第一极性的第一和第二离子外离子注入区域和第二极性的第三离子间离子注入区域。

Public/Granted literature
Information query
Espacenet
IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00 专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70 .由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77 ..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78 ...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82 ....制造器件，例如每一个由许多元件组成的集成电路
H01L21/822 .....衬底是采用硅工艺的半导体的（H01L21/8258优先）
H01L21/8232 ......场效应工艺
H01L21/8234 .......MIS工艺
H01L21/8238 ........互补场效应晶体管，例如CMOS
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