发明授权
- 专利标题： Transparent heat shielding multilayer structure
- 专利标题（中）： 透明隔热多层结构
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申请号： US12189932申请日： 2008-08-12
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公开(公告)号： US07781055B2公开(公告)日： 2010-08-24
- 发明人: Pao-Tang Chung , Sung-Jeng Jong , Jer-Young Chen , Yih-Her Chang
- 申请人： Pao-Tang Chung , Sung-Jeng Jong , Jer-Young Chen , Yih-Her Chang
- 申请人地址： TW
- 专利权人： Industrial Technology Research Institute
- 当前专利权人： Industrial Technology Research Institute
- 当前专利权人地址： TW
- 代理机构： Lowe Hauptman Ham & Berner, LLP
- 优先权： TW97119333A 20080526
- 主分类号： B32B5/16
- IPC分类号： B32B5/16
摘要：
A transparent heat shielding multilayer structure is disclosed. The multilayer structure includes: a transparent base film; a first transparent heat shielding layer with lanthanum hexaboride (LaB6) nanoparticles dispersed therein; and a second heat shielding layer with ATO (antimony doped tin oxide), ITO (indium tin oxide), or metal doped tungsten oxide nanoparticles dispersed therein. The first and second transparent heat shielding layers may be disposed on the same side or opposite sides of the transparent base film.
公开/授权文献
- US20090291295A1 TRANSPARENT HEAT SHIELDING MULTILAYER STRUCTURE 公开/授权日：2009-11-26
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