发明授权
- 专利标题: Zigzag-stacked package structure
- 专利标题(中): 曲折堆叠包装结构
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申请号: US12017014申请日: 2008-01-19
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公开(公告)号: US07781878B2公开(公告)日: 2010-08-24
- 发明人: Yu-Ren Chen , Yeong-Jyh Lin
- 申请人: Yu-Ren Chen , Yeong-Jyh Lin
- 申请人地址: TW Hsinchu
- 专利权人: Chipmos Technologies Inc.
- 当前专利权人: Chipmos Technologies Inc.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Ming Chow Sinorica, LLC
- 优先权: TW96102091A 20070119
- 主分类号: H01L23/02
- IPC分类号: H01L23/02 ; H01L23/48 ; H01L23/52 ; H01L29/40
摘要:
A die-stacked package structure, wherein a plurality of dies are stacked on the substrate with a rotation so that a plurality of metallic ends and the metal pad on each die on the substrate can all be exposed; a plurality of metal wires are provided for electrically connecting the plurality of metal pads on the plurality of dies with the plurality metallic ends on the substrate in one wire bonding process; then an encapsulate is provided for covering the plurality of stacked dies, a plurality of metal wires and the plurality of metallic ends on the substrate.
公开/授权文献
- US20080174000A1 Zigzag-stacked package structure 公开/授权日:2008-07-24