发明授权
- 专利标题： Processing apparatus and method
- 专利标题（中）： 处理装置和方法
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申请号： US11149046申请日： 2005-06-08
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公开(公告)号： US07789647B2公开(公告)日： 2010-09-07
- 发明人: Eigo Kawakami , Hirohisa Ota , Takashi Nakamura , Kazuyuki Kasumi , Toshinobu Tokita
- 申请人： Eigo Kawakami , Hirohisa Ota , Takashi Nakamura , Kazuyuki Kasumi , Toshinobu Tokita
- 申请人地址： JP
- 专利权人： Canon Kabushiki Kaisha
- 当前专利权人： Canon Kabushiki Kaisha
- 当前专利权人地址： JP
- 代理机构： Rossi, Kimms & McDowell LLP
- 优先权： JP2004-173317 20040611
- 主分类号： B28B17/00
- IPC分类号： B28B17/00 ; B29C35/08 ; B29C59/00
摘要：
A processing apparatus for transferring a relief pattern on a mold to a resist on a substrate through a compression of the mold against the resist, and an irradiation of light for exposing the resist onto the resist includes a mold chuck for holding the mold and for compressing the mold against the resist, and a deformation reducing part for reducing a deformation of the mold when the mold chuck applies a compression force to the mold.
公开/授权文献
- US20050275125A1 Processing apparatus and method 公开/授权日：2005-12-15