发明授权
US07789988B2 Method for separating protective tape, and apparatus using the same
失效
分离保护胶带的方法及使用其的装置
- 专利标题： Method for separating protective tape, and apparatus using the same
- 专利标题（中）： 分离保护胶带的方法及使用其的装置
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申请号： US11723239申请日： 2007-03-19
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公开(公告)号： US07789988B2公开(公告)日： 2010-09-07
- 发明人: Masayuki Yamamoto , Takao Matsushita , Masaki Sakata
- 申请人： Masayuki Yamamoto , Takao Matsushita , Masaki Sakata
- 申请人地址： JP Osaka
- 专利权人： Nitto Denko Corporation
- 当前专利权人： Nitto Denko Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Cheng Law Group, PLLC
- 优先权： JP2006-114766 20060418; JP2006-203651 20060726
- 主分类号： B29C65/50
- IPC分类号： B29C65/50 ; B32B38/10 ; B32B43/00
摘要：
A peripheral edge of a protective tape joined to a front face of a semiconductor wafer is snagged on a needle having a sharp tip end so as to be partially separated from the front face of the semiconductor wafer; thus, a separated portion is formed. Next, an operation of joining a separating tape to a surface of the protective tape is started from the separated portion, and the protective tape is separated together with the separating tape from the front face of the semiconductor wafer with the separated portion as a starting end.
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