A printhead module for a printhead assembly of a pagewidth ink jet printer. The printhead module comprises: an upper micromolding locating a printhead integrated circuit, wherein the upper micromolding includes a first series of ink inlets in fluid communication with the printhead integrated circuit; a lower micromolding including a second series of ink inlets which are in fluid communication with the first series of ink inlets; and a mid-package film located between the upper and lower micromoldings, wherein the mid-package film includes a plurality of holes through which ink passes from the second series of ink inlets to the first series of ink inlets.