发明授权
- 专利标题： Accurate alignment of an LED assembly
- 专利标题（中）： LED组件的准确对准
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申请号： US11626280申请日： 2007-01-23
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公开(公告)号： US07795051B2公开(公告)日： 2010-09-14
- 发明人: Cresente S. Elpedes , Zainul Fiteri bin Aziz , Paul S. Martin
- 申请人： Cresente S. Elpedes , Zainul Fiteri bin Aziz , Paul S. Martin
- 专利权人： Philips Lumileds Lighting Company, LLC,Koninklijke Philips Electronics N.V.
- 当前专利权人： Philips Lumileds Lighting Company, LLC,Koninklijke Philips Electronics N.V.
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
An LED assembly includes a heat sink and a submount. The heat sink has a top mating surface that is solder wettable, and the submount has a bottom mating surface that is solder wettable. The top and the bottom mating surfaces have substantially the same shape and area. The submount is soldered atop the heat sink. During solder reflow, the molten solder causes the submount to align with the top mating surface of the heat sink. The LED assembly may further include a substrate having a top mating surface, and the heat sink may further include a bottom mating surface. The top and bottom mating surfaces have substantially the same shape and area. The heat sink is soldered atop the substrate. During solder reflow, the molten solder causes the heat sink to align with the top mating surface of the substrate.
公开/授权文献
- US20070117273A1 Accurate Alignment of an LED Assembly 公开/授权日：2007-05-24
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